Group Leader – Die Attach & Underfill

Job/Position Summary The Group Leader – Die Attach & Underfill is responsible for leading development, optimization, qualification, and manufacturing support activities for flip chip die attach, epoxy and film die attach, mass reflow, flux cleaning, plasma treatment, capillary underfill, and cure processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and underfill performance with emphasis on placement accuracy, solder joint integrity, underfill flo…