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Package Design Engineer
TYLsemi
📍 Bangalore, Karnataka, India
via Adzuna API (IN)
Full-TimeOn-Site
Description
Role Overview TYLsemi is seeking a Staff - Package Design Engineer to own design of IC packages (flip-chip, wirebond and 2.5D/interposer platforms) for high-speed digital and data-center-class products. The successful candidate will drive package design from bump/ball map definition through substrate stack-up, routing, signal/power integrity closure, and tapeout — working closely with SI/PI, silicon design, and test engineering to deliver package designs that are robust against real silicon fee…
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