Advanced Packaging Design Engineer - AI-Driven, 2.5D/3D

Advanced Micro Devices (S) Pte Ltd is seeking a highly experienced Package Design Engineer to drive end-to-end package design for complex products in a fast-paced, high-pressure environment. The role requires ownership across multiple programs and delivering high-quality designs with speed and precision. You will develop substrate layouts, bump maps, and interposer designs for 2.5D/3D architectures, collaborate with SI/PI, mechanical, and SOC teams, and advance design methodologies using J-1880…