Advanced Packaging & Thermal Characterization Engineer

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands‑on thermal and mechanical characterization of packaging materials and assemblies with IVR test‑vehicle work. You will establish lab capabilities, run experiments, and translate results into actionable insights for next‑gen packaging programs. The successful candidate works with cross‑functional teams across design, modeling, reliability, facilities…