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Lead Research Engineer (FAB), Bonding Process Control, IME
Belirtilmemiş İşveren
📍 Singapore, Malaysia
via Adzuna
Sepenuh MasaDi Lokasi
Keterangan
Bonding Process Control Engineer - Role Summary We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining wafer-level bonding processes-including hybrid wafer-to-wafer bonding, chip-to-wafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses. This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process-control strategies for both development and small-volume p…
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