Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

Key Responsibilities Develop and enable advanced package technology for various post-fab wafer finish and assembly processes. Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity. Integrate semiconductors while partnering with process and product engineering teams. Achieve and improve yields through silicon package integration innovation, including layout/design and process margin improvements. Collect and analyze data to provide actionable …