Senior Process Module Engineer, 2.5D/3D Advanced Packaging

GlobalFoundries Singapore seeks an Experienced Member of Technical Staff (MTS) / Principal Process Engineer to join our 300mm Advanced Packaging Center. You will develop and optimize advanced packaging processes (bond & debond, pre-bond, plasma/UV cleaning, die reconstitution, annealing and TSV) for multi-stack wafer / D2W workflows. You will lead cross-functional teams, start-up tooling, qualify new equipment, drive process robustness with DOE and statistical methods, and coach peers while J-1…