Senior/Staff Process Engineer (Wafer Bumping/Fan-Out)

Lead the process development and technical support of the wafer bumping, and/or Fan-Out process for silicon photonic chip wafers, with OSAT or at internal line. Process Pathfinding & Integration: Design and optimize early-stage process flows for wafer bumping, thin-film sputtering, lithography, electroplating, and ball drop execution. DOE to characterize process window and margin. Material Characterization & Selection: Evaluate and qualify new manufacturing raw materials, including dielectric p…